m3x1m0m
/
UppSense2017
1
0
Fork 0
Code Issues Pull Requests Releases Wiki Activity
Browse Source

Finished layout of transimpedance amplifier.

master
Maximilian Stiefel 8 years ago
parent
0a0494cb10
commit
280e553a9e
1 changed files with 102 additions and 102 deletions
Whitespace
Show all changes Ignore whitespace when comparing lines Ignore changes in amount of whitespace Ignore changes in whitespace at EOL
Split View
Diff Options
Show Stats Download Patch File Download Diff File
  1. 204
      pcb/transimpedance_amp/transimpedance_amp.kicad_pcb

204
pcb/transimpedance_amp/transimpedance_amp.kicad_pcb
View File

@ -3,7 +3,7 @@
(general
(links 87)
(no_connects 0)
(area 100.657143 68.3 220.890477 133.238333)
(area 106.899999 80.899999 187.100001 131.100001)
(thickness 1.6)
(drawings 6)
(tracks 144)
@ -37,7 +37,7 @@
)
(setup
(last_trace_width 0.5)
(last_trace_width 0.25)
(user_trace_width 0.5)
(trace_clearance 0.2)
(zone_clearance 0.3)
@ -65,7 +65,7 @@
(pad_to_mask_clearance 0.2)
(aux_axis_origin 0 0)
(grid_origin 134.874 122.682)
(visible_elements FFFFFF5F)
(visible_elements FFFEFF7F)
(pcbplotparams
(layerselection 0x00030_80000001)
(usegerberextensions false)
@ -140,9 +140,9 @@
(add_net "Net-(P7-Pad1)")
)
(module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF196A) (tstamp 58FFB7ED)
(at 182.118 102.108)
(fp_text reference REF** (at 0 -3.81) (layer F.SilkS)
(module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF5473) (tstamp 58FF551C)
(at 178.816 115.57)
(fp_text reference REF** (at 0 -3.81) (layer F.SilkS) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value SolderWirePad_single_1mmDrill (at -1.905 3.175) (layer F.Fab)
@ -152,9 +152,9 @@
(net 9 GND))
)
(module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF196A) (tstamp 58FFB7E8)
(at 178.816 115.062)
(fp_text reference REF** (at 0 -3.81) (layer F.SilkS)
(module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF5473) (tstamp 58FF5517)
(at 167.132 120.65)
(fp_text reference REF** (at 0 -3.81) (layer F.SilkS) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value SolderWirePad_single_1mmDrill (at -1.905 3.175) (layer F.Fab)
@ -164,9 +164,9 @@
(net 9 GND))
)
(module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF196A) (tstamp 58FFB7E3)
(at 167.132 120.904)
(fp_text reference REF** (at 0 -3.81) (layer F.SilkS)
(module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF5473) (tstamp 58FF5512)
(at 173.482 121.412)
(fp_text reference REF** (at 0 -3.81) (layer F.SilkS) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value SolderWirePad_single_1mmDrill (at -1.905 3.175) (layer F.Fab)
@ -176,9 +176,9 @@
(net 9 GND))
)
(module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF196A) (tstamp 58FFB7DE)
(at 173.482 121.412)
(fp_text reference REF** (at 0 -3.81) (layer F.SilkS)
(module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF5473) (tstamp 58FF550D)
(at 161.036 120.904)
(fp_text reference REF** (at 0 -3.81) (layer F.SilkS) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value SolderWirePad_single_1mmDrill (at -1.905 3.175) (layer F.Fab)
@ -188,9 +188,9 @@
(net 9 GND))
)
(module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF196A) (tstamp 58FFB7D9)
(at 160.782 120.65)
(fp_text reference REF** (at 0 -3.81) (layer F.SilkS)
(module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF5473) (tstamp 58FF54E8)
(at 148.59 116.332)
(fp_text reference REF** (at 0 -3.81) (layer F.SilkS) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value SolderWirePad_single_1mmDrill (at -1.905 3.175) (layer F.Fab)
@ -200,9 +200,9 @@
(net 9 GND))
)
(module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF196A) (tstamp 58FFB7D4)
(at 148.59 116.332)
(fp_text reference REF** (at 0 -3.81) (layer F.SilkS)
(module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF5473) (tstamp 58FF54AA)
(at 140.208 120.142)
(fp_text reference REF** (at 0 -3.81) (layer F.SilkS) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value SolderWirePad_single_1mmDrill (at -1.905 3.175) (layer F.Fab)
@ -212,9 +212,21 @@
(net 9 GND))
)
(module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF196A) (tstamp 58FFB7CF)
(at 140.208 120.142)
(fp_text reference REF** (at 0 -3.81) (layer F.SilkS)
(module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF5473) (tstamp 58FF54A1)
(at 127.762 123.444)
(fp_text reference REF** (at 0 -3.81) (layer F.SilkS) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value SolderWirePad_single_1mmDrill (at -1.905 3.175) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(pad 1 thru_hole circle (at 0 0) (size 2.49936 2.49936) (drill 1.00076) (layers *.Cu)
(net 9 GND))
)
(module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF5630) (tstamp 58FFB7ED)
(at 182.118 102.108)
(fp_text reference REF** (at 0 -3.81) (layer F.SilkS) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value SolderWirePad_single_1mmDrill (at -1.905 3.175) (layer F.Fab)
@ -224,9 +236,9 @@
(net 9 GND))
)
(module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF196A) (tstamp 58FFB7CA)
(module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF5473) (tstamp 58FFB7CA)
(at 134.112 121.158)
(fp_text reference REF** (at 0 -3.81) (layer F.SilkS)
(fp_text reference REF** (at 0 -3.81) (layer F.SilkS) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value SolderWirePad_single_1mmDrill (at -1.905 3.175) (layer F.Fab)
@ -236,11 +248,11 @@
(net 9 GND))
)
(module Mounting_Holes:MountingHole_3.2mm_M3_Pad (layer F.Cu) (tedit 56D1B4CB) (tstamp 58FF0A6E)
(module Mounting_Holes:MountingHole_3.2mm_M3_Pad (layer F.Cu) (tedit 58FF5599) (tstamp 58FF0A6E)
(at 182 126)
(descr "Mounting Hole 3.2mm, M3")
(tags "mounting hole 3.2mm m3")
(fp_text reference REF** (at 0 -4.2) (layer F.SilkS)
(fp_text reference REF** (at 0 -4.2) (layer F.SilkS) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value MountingHole_3.2mm_M3_Pad (at 0 4.2) (layer F.Fab)
@ -329,12 +341,12 @@
)
)
(module Pin_Headers:Pin_Header_Straight_1x05 (layer F.Cu) (tedit 54EA0684) (tstamp 590018C2)
(module Pin_Headers:Pin_Header_Straight_1x05 (layer F.Cu) (tedit 58FF55EC) (tstamp 590018C2)
(at 157.13 125.665 90)
(descr "Through hole pin header")
(tags "pin header")
(path /58FDC9E0)
(fp_text reference P3 (at 0 -5.1 90) (layer F.SilkS)
(fp_text reference P3 (at -0.573 -2.698 180) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value CONN_01X05 (at 0 -3.1 90) (layer F.Fab)
@ -368,12 +380,12 @@
)
)
(module Pin_Headers:Pin_Header_Straight_1x05 (layer F.Cu) (tedit 54EA0684) (tstamp 590018D6)
(module Pin_Headers:Pin_Header_Straight_1x05 (layer F.Cu) (tedit 58FF55DB) (tstamp 590018D6)
(at 157.13 128.205 90)
(descr "Through hole pin header")
(tags "pin header")
(path /58FDC97C)
(fp_text reference P4 (at 0 -5.1 90) (layer F.SilkS)
(fp_text reference P4 (at -1.335 -2.698 180) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value CONN_01X05 (at 0 -3.1 90) (layer F.Fab)
@ -477,12 +489,12 @@
(net 9 GND))
)
(module Pin_Headers:Pin_Header_Straight_1x05 (layer F.Cu) (tedit 54EA0684) (tstamp 590092AC)
(module Pin_Headers:Pin_Header_Straight_1x05 (layer F.Cu) (tedit 58FF55E4) (tstamp 590092AC)
(at 150.352 128.16 270)
(descr "Through hole pin header")
(tags "pin header")
(path /58FE91E6)
(fp_text reference P5 (at 0 -5.1 270) (layer F.SilkS)
(fp_text reference P5 (at 0.11 -2.81 360) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value CONN_01X05 (at 0 -3.1 270) (layer F.Fab)
@ -516,12 +528,12 @@
)
)
(module Pin_Headers:Pin_Header_Straight_1x05 (layer F.Cu) (tedit 54EA0684) (tstamp 590092C0)
(module Pin_Headers:Pin_Header_Straight_1x05 (layer F.Cu) (tedit 58FF55EF) (tstamp 590092C0)
(at 150.352 125.62 270)
(descr "Through hole pin header")
(tags "pin header")
(path /58FE928D)
(fp_text reference P6 (at 0 -5.1 270) (layer F.SilkS)
(fp_text reference P6 (at -1.16 -2.81 360) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value CONN_01X05 (at 0 -3.1 270) (layer F.Fab)
@ -633,13 +645,13 @@
)
)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58307B54) (tstamp 59009338)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF540D) (tstamp 59009338)
(at 123.205 119.315 270)
(descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0805")
(path /58FE91DA)
(attr smd)
(fp_text reference R10 (at 0 -2.1 270) (layer F.SilkS)
(fp_text reference R10 (at 2.605 0.269 360) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value 100M (at 0 2.1 270) (layer F.Fab)
@ -666,13 +678,13 @@
)
)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58307B54) (tstamp 58FDEFD0)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF55A4) (tstamp 58FDEFD0)
(at 184.435 119.315 270)
(descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0805")
(path /58FDC47A)
(attr smd)
(fp_text reference R1 (at 0 -2.1 270) (layer F.SilkS)
(fp_text reference R1 (at 2.351 -0.223 360) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value 100M (at 0 2.1 270) (layer F.Fab)
@ -699,13 +711,13 @@
)
)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58307B54) (tstamp 58FDEFD5)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF5584) (tstamp 58FDEFD5)
(at 175.545 119.315 270)
(descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0805")
(path /58FDCBC3)
(attr smd)
(fp_text reference R2 (at 0 -2.1 270) (layer F.SilkS)
(fp_text reference R2 (at 2.351 0.031 360) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value 10M (at 0 2.1 270) (layer F.Fab)
@ -732,13 +744,13 @@
)
)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58307B54) (tstamp 58FDEFDA)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF5579) (tstamp 58FDEFDA)
(at 169.195 119.315 270)
(descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0805")
(path /58FDCCA7)
(attr smd)
(fp_text reference R3 (at 0 -2.1 270) (layer F.SilkS)
(fp_text reference R3 (at 2.605 0.031 360) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value 1M (at 0 2.1 270) (layer F.Fab)
@ -765,13 +777,13 @@
)
)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58307B54) (tstamp 58FDEFDF)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF556D) (tstamp 58FDEFDF)
(at 162.845 119.315 270)
(descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0805")
(path /58FDCD16)
(attr smd)
(fp_text reference R4 (at 0 -2.1 270) (layer F.SilkS)
(fp_text reference R4 (at 2.605 0.031 360) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value 100k (at 0 2.1 270) (layer F.Fab)
@ -798,13 +810,13 @@
)
)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58307B54) (tstamp 58FDEFE4)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF5544) (tstamp 58FDEFE4)
(at 156.495 119.315 270)
(descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0805")
(path /58FDCDBF)
(attr smd)
(fp_text reference R5 (at 0 -2.1 270) (layer F.SilkS)
(fp_text reference R5 (at 2.605 0.031 360) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value 10k (at 0 2.1 270) (layer F.Fab)
@ -831,13 +843,13 @@
)
)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58307B54) (tstamp 58FDEFE9)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF53CF) (tstamp 58FDEFE9)
(at 148.605 119.315 270)
(descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0805")
(path /58FE9210)
(attr smd)
(fp_text reference R6 (at 0 -2.1 270) (layer F.SilkS)
(fp_text reference R6 (at 2.605 0.015 360) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value 10k (at 0 2.1 270) (layer F.Fab)
@ -864,13 +876,13 @@
)
)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58307B54) (tstamp 58FDEFEE)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF53DA) (tstamp 58FDEFEE)
(at 144.795 119.315 270)
(descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0805")
(path /58FE9204)
(attr smd)
(fp_text reference R7 (at 0 -2.1 270) (layer F.SilkS)
(fp_text reference R7 (at 2.605 0.015 360) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value 100k (at 0 2.1 270) (layer F.Fab)
@ -897,13 +909,13 @@
)
)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58307B54) (tstamp 58FDEFF3)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF53E9) (tstamp 58FDEFF3)
(at 138.445 119.315 270)
(descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0805")
(path /58FE91F8)
(attr smd)
(fp_text reference R8 (at 0 -2.1 270) (layer F.SilkS)
(fp_text reference R8 (at 2.605 0.015 360) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value 1M (at 0 2.1 270) (layer F.Fab)
@ -930,13 +942,13 @@
)
)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58307B54) (tstamp 58FDEFF8)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF53F5) (tstamp 58FDEFF8)
(at 132.095 119.315 270)
(descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0805")
(path /58FE91EC)
(attr smd)
(fp_text reference R9 (at 0 -2.1 270) (layer F.SilkS)
(fp_text reference R9 (at 2.605 0.015 360) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value 10M (at 0 2.1 270) (layer F.Fab)
@ -963,13 +975,13 @@
)
)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58307B54) (tstamp 58FE111C)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF55A0) (tstamp 58FE111C)
(at 181.895 119.315 270)
(descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0805")
(path /58FDC56B)
(attr smd)
(fp_text reference C1 (at 0 -2.1 270) (layer F.SilkS)
(fp_text reference C1 (at 2.351 0.031 360) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value 1p (at 0 2.1 270) (layer F.Fab)
@ -996,13 +1008,13 @@
)
)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58307B54) (tstamp 58FE1121)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF558A) (tstamp 58FE1121)
(at 178.085 119.315 270)
(descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0805")
(path /58FDCBC9)
(attr smd)
(fp_text reference C2 (at 0 -2.1 270) (layer F.SilkS)
(fp_text reference C2 (at 2.351 0.031 360) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value 10p (at 0 2.1 270) (layer F.Fab)
@ -1029,13 +1041,13 @@
)
)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58307B54) (tstamp 58FE1126)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF557E) (tstamp 58FE1126)
(at 171.735 119.315 270)
(descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0805")
(path /58FDCCAD)
(attr smd)
(fp_text reference C3 (at 0 -2.1 270) (layer F.SilkS)
(fp_text reference C3 (at 2.605 0.031 360) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value 100p (at 0 2.1 270) (layer F.Fab)
@ -1062,13 +1074,13 @@
)
)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58307B54) (tstamp 58FE112B)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF5572) (tstamp 58FE112B)
(at 165.385 119.315 270)
(descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0805")
(path /58FDCD1C)
(attr smd)
(fp_text reference C4 (at 0 -2.1 270) (layer F.SilkS)
(fp_text reference C4 (at 2.605 0.031 360) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value 1n (at 0 2.1 270) (layer F.Fab)
@ -1095,13 +1107,13 @@
)
)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58307B54) (tstamp 58FE1130)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF554A) (tstamp 58FE1130)
(at 159.035 119.315 270)
(descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0805")
(path /58FDCDC5)
(attr smd)
(fp_text reference C5 (at 0 -2.1 270) (layer F.SilkS)
(fp_text reference C5 (at 2.605 0.031 360) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value 10n (at 0 2.1 270) (layer F.Fab)
@ -1128,13 +1140,13 @@
)
)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58307B54) (tstamp 58FE1135)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF53C5) (tstamp 58FE1135)
(at 151.145 119.315 270)
(descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0805")
(path /58FE9216)
(attr smd)
(fp_text reference C6 (at 0 -2.1 270) (layer F.SilkS)
(fp_text reference C6 (at 2.605 0.015 360) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value 10n (at 0 2.1 270) (layer F.Fab)
@ -1161,13 +1173,13 @@
)
)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58307B54) (tstamp 58FE113A)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF53E0) (tstamp 58FE113A)
(at 142.255 119.315 270)
(descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0805")
(path /58FE920A)
(attr smd)
(fp_text reference C7 (at 0 -2.1 270) (layer F.SilkS)
(fp_text reference C7 (at 2.605 0.015 360) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value 1n (at 0 2.1 270) (layer F.Fab)
@ -1194,13 +1206,13 @@
)
)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58307B54) (tstamp 58FE113F)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF53EE) (tstamp 58FE113F)
(at 135.905 119.315 270)
(descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0805")
(path /58FE91FE)
(attr smd)
(fp_text reference C8 (at 0 -2.1 270) (layer F.SilkS)
(fp_text reference C8 (at 2.605 0.015 360) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value 100p (at 0 2.1 270) (layer F.Fab)
@ -1227,13 +1239,13 @@
)
)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58307B54) (tstamp 58FE1144)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF53FD) (tstamp 58FE1144)
(at 129.555 119.315 270)
(descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0805")
(path /58FE91F2)
(attr smd)
(fp_text reference C9 (at 0 -2.1 270) (layer F.SilkS)
(fp_text reference C9 (at 2.605 0.015 360) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value 10p (at 0 2.1 270) (layer F.Fab)
@ -1260,13 +1272,13 @@
)
)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58307B54) (tstamp 58FE1149)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF5408) (tstamp 58FE1149)
(at 125.745 119.315 270)
(descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0805")
(path /58FE91E0)
(attr smd)
(fp_text reference C10 (at 0 -2.1 270) (layer F.SilkS)
(fp_text reference C10 (at 2.605 0.015 360) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value 1p (at 0 2.1 270) (layer F.Fab)
@ -1293,13 +1305,13 @@
)
)
(module SMD_Packages:SOIC-8-N (layer F.Cu) (tedit 0) (tstamp 58FE285D)
(module SMD_Packages:SOIC-8-N (layer F.Cu) (tedit 58FF2673) (tstamp 58FE285D)
(at 136.398 97.028 270)
(descr "Module Narrow CMS SOJ 8 pins large")
(tags "CMS SOJ")
(path /58FDBB28)
(attr smd)
(fp_text reference U1 (at 0 -1.27 270) (layer F.SilkS)
(fp_text reference U1 (at -3.81 1.524 360) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value AD8616 (at 0 1.27 270) (layer F.Fab)
@ -1335,11 +1347,11 @@
)
)
(module Mounting_Holes:MountingHole_3.2mm_M3_Pad (layer F.Cu) (tedit 56D1B4CB) (tstamp 58FE333D)
(module Mounting_Holes:MountingHole_3.2mm_M3_Pad (layer F.Cu) (tedit 58FF564A) (tstamp 58FE333D)
(at 112 86)
(descr "Mounting Hole 3.2mm, M3")
(tags "mounting hole 3.2mm m3")
(fp_text reference REF** (at 0 -4.2) (layer F.SilkS)
(fp_text reference REF** (at 0 -4.2) (layer F.SilkS) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value MountingHole_3.2mm_M3_Pad (at 0 4.2) (layer F.Fab)
@ -1350,11 +1362,11 @@
(pad 1 thru_hole circle (at 0 0) (size 6.4 6.4) (drill 3.2) (layers *.Cu *.Mask))
)
(module Mounting_Holes:MountingHole_3.2mm_M3_Pad (layer F.Cu) (tedit 56D1B4CB) (tstamp 58FE3349)
(module Mounting_Holes:MountingHole_3.2mm_M3_Pad (layer F.Cu) (tedit 58FF5641) (tstamp 58FE3349)
(at 112 126)
(descr "Mounting Hole 3.2mm, M3")
(tags "mounting hole 3.2mm m3")
(fp_text reference REF** (at 0 -4.2) (layer F.SilkS)
(fp_text reference REF** (at 0 -4.2) (layer F.SilkS) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value MountingHole_3.2mm_M3_Pad (at 0 4.2) (layer F.Fab)
@ -1365,11 +1377,11 @@
(pad 1 thru_hole circle (at 0 0) (size 6.4 6.4) (drill 3.2) (layers *.Cu *.Mask))
)
(module Mounting_Holes:MountingHole_3.2mm_M3_Pad (layer F.Cu) (tedit 56D1B4CB) (tstamp 58FE3366)
(module Mounting_Holes:MountingHole_3.2mm_M3_Pad (layer F.Cu) (tedit 58FF5638) (tstamp 58FE3366)
(at 182 86)
(descr "Mounting Hole 3.2mm, M3")
(tags "mounting hole 3.2mm m3")
(fp_text reference REF** (at 0 -4.2) (layer F.SilkS)
(fp_text reference REF** (at 0 -4.2) (layer F.SilkS) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value MountingHole_3.2mm_M3_Pad (at 0 4.2) (layer F.Fab)
@ -1380,10 +1392,10 @@
(pad 1 thru_hole circle (at 0 0) (size 6.4 6.4) (drill 3.2) (layers *.Cu *.Mask))
)
(module Testpoints:TP_SMD_quadr_3mm (layer F.Cu) (tedit 58FF0D14) (tstamp 58FFB0B5)
(module Testpoints:TP_SMD_quadr_3mm (layer F.Cu) (tedit 58FF5625) (tstamp 58FFB0B5)
(at 173.482 128.27)
(path /58FE3886)
(fp_text reference TP1 (at 0 2.54) (layer F.SilkS)
(fp_text reference TP1 (at 3.302 0) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value TEST (at 0 -2.54) (layer F.Fab)
@ -1393,10 +1405,10 @@
(net 7 "Net-(P4-Pad1)"))
)
(module Testpoints:TP_SMD_quadr_3mm (layer F.Cu) (tedit 58FF0D14) (tstamp 58FFB0B9)
(module Testpoints:TP_SMD_quadr_3mm (layer F.Cu) (tedit 58FF266A) (tstamp 58FFB0B9)
(at 139.7 91.694)
(path /58FEC254)
(fp_text reference TP2 (at 0 2.54) (layer F.SilkS)
(fp_text reference TP2 (at 0 -3.302) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value TEST (at 0 -2.54) (layer F.Fab)
@ -1419,10 +1431,10 @@
(net 9 GND))
)
(module Testpoints:TP_SMD_quadr_3mm (layer F.Cu) (tedit 58FF0D14) (tstamp 58FFB0C2)
(module Testpoints:TP_SMD_quadr_3mm (layer F.Cu) (tedit 58FF561C) (tstamp 58FFB0C2)
(at 133.604 128.27)
(path /58FE922E)
(fp_text reference TP4 (at 0 2.54) (layer F.SilkS)
(fp_text reference TP4 (at -3.556 0) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value TEST (at 0 -2.54) (layer F.Fab)
@ -1432,18 +1444,6 @@
(net 17 "Net-(P5-Pad1)"))
)
(module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF196A) (tstamp 58FFB7B9)
(at 127.762 122.936)
(fp_text reference REF** (at 0 -3.81) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value SolderWirePad_single_1mmDrill (at -1.905 3.175) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(pad 1 thru_hole circle (at 0 0) (size 2.49936 2.49936) (drill 1.00076) (layers *.Cu)
(net 9 GND))
)
(dimension 20 (width 0.3) (layer Dwgs.User)
(gr_text "20,000 mm" (at 117 69.65) (layer Dwgs.User)
(effects (font (size 1.5 1.5) (thickness 0.3)))

Write Preview
Loading…
Cancel
Save