diff --git a/pcb/transimpedance_amp/transimpedance_amp.kicad_pcb b/pcb/transimpedance_amp/transimpedance_amp.kicad_pcb
index a883ae4..960938a 100644
--- a/pcb/transimpedance_amp/transimpedance_amp.kicad_pcb
+++ b/pcb/transimpedance_amp/transimpedance_amp.kicad_pcb
@@ -3,7 +3,7 @@
   (general
     (links 87)
     (no_connects 0)
-    (area 100.657143 68.3 220.890477 133.238333)
+    (area 106.899999 80.899999 187.100001 131.100001)
     (thickness 1.6)
     (drawings 6)
     (tracks 144)
@@ -37,7 +37,7 @@
   )
 
   (setup
-    (last_trace_width 0.5)
+    (last_trace_width 0.25)
     (user_trace_width 0.5)
     (trace_clearance 0.2)
     (zone_clearance 0.3)
@@ -65,7 +65,7 @@
     (pad_to_mask_clearance 0.2)
     (aux_axis_origin 0 0)
     (grid_origin 134.874 122.682)
-    (visible_elements FFFFFF5F)
+    (visible_elements FFFEFF7F)
     (pcbplotparams
       (layerselection 0x00030_80000001)
       (usegerberextensions false)
@@ -140,9 +140,9 @@
     (add_net "Net-(P7-Pad1)")
   )
 
-  (module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF196A) (tstamp 58FFB7ED)
-    (at 182.118 102.108)
-    (fp_text reference REF** (at 0 -3.81) (layer F.SilkS)
+  (module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF5473) (tstamp 58FF551C)
+    (at 178.816 115.57)
+    (fp_text reference REF** (at 0 -3.81) (layer F.SilkS) hide
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value SolderWirePad_single_1mmDrill (at -1.905 3.175) (layer F.Fab)
@@ -152,9 +152,9 @@
       (net 9 GND))
   )
 
-  (module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF196A) (tstamp 58FFB7E8)
-    (at 178.816 115.062)
-    (fp_text reference REF** (at 0 -3.81) (layer F.SilkS)
+  (module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF5473) (tstamp 58FF5517)
+    (at 167.132 120.65)
+    (fp_text reference REF** (at 0 -3.81) (layer F.SilkS) hide
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value SolderWirePad_single_1mmDrill (at -1.905 3.175) (layer F.Fab)
@@ -164,9 +164,9 @@
       (net 9 GND))
   )
 
-  (module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF196A) (tstamp 58FFB7E3)
-    (at 167.132 120.904)
-    (fp_text reference REF** (at 0 -3.81) (layer F.SilkS)
+  (module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF5473) (tstamp 58FF5512)
+    (at 173.482 121.412)
+    (fp_text reference REF** (at 0 -3.81) (layer F.SilkS) hide
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value SolderWirePad_single_1mmDrill (at -1.905 3.175) (layer F.Fab)
@@ -176,9 +176,9 @@
       (net 9 GND))
   )
 
-  (module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF196A) (tstamp 58FFB7DE)
-    (at 173.482 121.412)
-    (fp_text reference REF** (at 0 -3.81) (layer F.SilkS)
+  (module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF5473) (tstamp 58FF550D)
+    (at 161.036 120.904)
+    (fp_text reference REF** (at 0 -3.81) (layer F.SilkS) hide
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value SolderWirePad_single_1mmDrill (at -1.905 3.175) (layer F.Fab)
@@ -188,9 +188,9 @@
       (net 9 GND))
   )
 
-  (module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF196A) (tstamp 58FFB7D9)
-    (at 160.782 120.65)
-    (fp_text reference REF** (at 0 -3.81) (layer F.SilkS)
+  (module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF5473) (tstamp 58FF54E8)
+    (at 148.59 116.332)
+    (fp_text reference REF** (at 0 -3.81) (layer F.SilkS) hide
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value SolderWirePad_single_1mmDrill (at -1.905 3.175) (layer F.Fab)
@@ -200,9 +200,9 @@
       (net 9 GND))
   )
 
-  (module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF196A) (tstamp 58FFB7D4)
-    (at 148.59 116.332)
-    (fp_text reference REF** (at 0 -3.81) (layer F.SilkS)
+  (module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF5473) (tstamp 58FF54AA)
+    (at 140.208 120.142)
+    (fp_text reference REF** (at 0 -3.81) (layer F.SilkS) hide
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value SolderWirePad_single_1mmDrill (at -1.905 3.175) (layer F.Fab)
@@ -212,9 +212,21 @@
       (net 9 GND))
   )
 
-  (module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF196A) (tstamp 58FFB7CF)
-    (at 140.208 120.142)
-    (fp_text reference REF** (at 0 -3.81) (layer F.SilkS)
+  (module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF5473) (tstamp 58FF54A1)
+    (at 127.762 123.444)
+    (fp_text reference REF** (at 0 -3.81) (layer F.SilkS) hide
+      (effects (font (size 1 1) (thickness 0.15)))
+    )
+    (fp_text value SolderWirePad_single_1mmDrill (at -1.905 3.175) (layer F.Fab)
+      (effects (font (size 1 1) (thickness 0.15)))
+    )
+    (pad 1 thru_hole circle (at 0 0) (size 2.49936 2.49936) (drill 1.00076) (layers *.Cu)
+      (net 9 GND))
+  )
+
+  (module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF5630) (tstamp 58FFB7ED)
+    (at 182.118 102.108)
+    (fp_text reference REF** (at 0 -3.81) (layer F.SilkS) hide
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value SolderWirePad_single_1mmDrill (at -1.905 3.175) (layer F.Fab)
@@ -224,9 +236,9 @@
       (net 9 GND))
   )
 
-  (module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF196A) (tstamp 58FFB7CA)
+  (module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF5473) (tstamp 58FFB7CA)
     (at 134.112 121.158)
-    (fp_text reference REF** (at 0 -3.81) (layer F.SilkS)
+    (fp_text reference REF** (at 0 -3.81) (layer F.SilkS) hide
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value SolderWirePad_single_1mmDrill (at -1.905 3.175) (layer F.Fab)
@@ -236,11 +248,11 @@
       (net 9 GND))
   )
 
-  (module Mounting_Holes:MountingHole_3.2mm_M3_Pad (layer F.Cu) (tedit 56D1B4CB) (tstamp 58FF0A6E)
+  (module Mounting_Holes:MountingHole_3.2mm_M3_Pad (layer F.Cu) (tedit 58FF5599) (tstamp 58FF0A6E)
     (at 182 126)
     (descr "Mounting Hole 3.2mm, M3")
     (tags "mounting hole 3.2mm m3")
-    (fp_text reference REF** (at 0 -4.2) (layer F.SilkS)
+    (fp_text reference REF** (at 0 -4.2) (layer F.SilkS) hide
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value MountingHole_3.2mm_M3_Pad (at 0 4.2) (layer F.Fab)
@@ -329,12 +341,12 @@
     )
   )
 
-  (module Pin_Headers:Pin_Header_Straight_1x05 (layer F.Cu) (tedit 54EA0684) (tstamp 590018C2)
+  (module Pin_Headers:Pin_Header_Straight_1x05 (layer F.Cu) (tedit 58FF55EC) (tstamp 590018C2)
     (at 157.13 125.665 90)
     (descr "Through hole pin header")
     (tags "pin header")
     (path /58FDC9E0)
-    (fp_text reference P3 (at 0 -5.1 90) (layer F.SilkS)
+    (fp_text reference P3 (at -0.573 -2.698 180) (layer F.SilkS)
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value CONN_01X05 (at 0 -3.1 90) (layer F.Fab)
@@ -368,12 +380,12 @@
     )
   )
 
-  (module Pin_Headers:Pin_Header_Straight_1x05 (layer F.Cu) (tedit 54EA0684) (tstamp 590018D6)
+  (module Pin_Headers:Pin_Header_Straight_1x05 (layer F.Cu) (tedit 58FF55DB) (tstamp 590018D6)
     (at 157.13 128.205 90)
     (descr "Through hole pin header")
     (tags "pin header")
     (path /58FDC97C)
-    (fp_text reference P4 (at 0 -5.1 90) (layer F.SilkS)
+    (fp_text reference P4 (at -1.335 -2.698 180) (layer F.SilkS)
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value CONN_01X05 (at 0 -3.1 90) (layer F.Fab)
@@ -477,12 +489,12 @@
       (net 9 GND))
   )
 
-  (module Pin_Headers:Pin_Header_Straight_1x05 (layer F.Cu) (tedit 54EA0684) (tstamp 590092AC)
+  (module Pin_Headers:Pin_Header_Straight_1x05 (layer F.Cu) (tedit 58FF55E4) (tstamp 590092AC)
     (at 150.352 128.16 270)
     (descr "Through hole pin header")
     (tags "pin header")
     (path /58FE91E6)
-    (fp_text reference P5 (at 0 -5.1 270) (layer F.SilkS)
+    (fp_text reference P5 (at 0.11 -2.81 360) (layer F.SilkS)
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value CONN_01X05 (at 0 -3.1 270) (layer F.Fab)
@@ -516,12 +528,12 @@
     )
   )
 
-  (module Pin_Headers:Pin_Header_Straight_1x05 (layer F.Cu) (tedit 54EA0684) (tstamp 590092C0)
+  (module Pin_Headers:Pin_Header_Straight_1x05 (layer F.Cu) (tedit 58FF55EF) (tstamp 590092C0)
     (at 150.352 125.62 270)
     (descr "Through hole pin header")
     (tags "pin header")
     (path /58FE928D)
-    (fp_text reference P6 (at 0 -5.1 270) (layer F.SilkS)
+    (fp_text reference P6 (at -1.16 -2.81 360) (layer F.SilkS)
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value CONN_01X05 (at 0 -3.1 270) (layer F.Fab)
@@ -633,13 +645,13 @@
     )
   )
 
-  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58307B54) (tstamp 59009338)
+  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF540D) (tstamp 59009338)
     (at 123.205 119.315 270)
     (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
     (tags "resistor 0805")
     (path /58FE91DA)
     (attr smd)
-    (fp_text reference R10 (at 0 -2.1 270) (layer F.SilkS)
+    (fp_text reference R10 (at 2.605 0.269 360) (layer F.SilkS)
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value 100M (at 0 2.1 270) (layer F.Fab)
@@ -666,13 +678,13 @@
     )
   )
 
-  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58307B54) (tstamp 58FDEFD0)
+  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF55A4) (tstamp 58FDEFD0)
     (at 184.435 119.315 270)
     (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
     (tags "resistor 0805")
     (path /58FDC47A)
     (attr smd)
-    (fp_text reference R1 (at 0 -2.1 270) (layer F.SilkS)
+    (fp_text reference R1 (at 2.351 -0.223 360) (layer F.SilkS)
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value 100M (at 0 2.1 270) (layer F.Fab)
@@ -699,13 +711,13 @@
     )
   )
 
-  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58307B54) (tstamp 58FDEFD5)
+  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF5584) (tstamp 58FDEFD5)
     (at 175.545 119.315 270)
     (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
     (tags "resistor 0805")
     (path /58FDCBC3)
     (attr smd)
-    (fp_text reference R2 (at 0 -2.1 270) (layer F.SilkS)
+    (fp_text reference R2 (at 2.351 0.031 360) (layer F.SilkS)
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value 10M (at 0 2.1 270) (layer F.Fab)
@@ -732,13 +744,13 @@
     )
   )
 
-  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58307B54) (tstamp 58FDEFDA)
+  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF5579) (tstamp 58FDEFDA)
     (at 169.195 119.315 270)
     (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
     (tags "resistor 0805")
     (path /58FDCCA7)
     (attr smd)
-    (fp_text reference R3 (at 0 -2.1 270) (layer F.SilkS)
+    (fp_text reference R3 (at 2.605 0.031 360) (layer F.SilkS)
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value 1M (at 0 2.1 270) (layer F.Fab)
@@ -765,13 +777,13 @@
     )
   )
 
-  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58307B54) (tstamp 58FDEFDF)
+  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF556D) (tstamp 58FDEFDF)
     (at 162.845 119.315 270)
     (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
     (tags "resistor 0805")
     (path /58FDCD16)
     (attr smd)
-    (fp_text reference R4 (at 0 -2.1 270) (layer F.SilkS)
+    (fp_text reference R4 (at 2.605 0.031 360) (layer F.SilkS)
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value 100k (at 0 2.1 270) (layer F.Fab)
@@ -798,13 +810,13 @@
     )
   )
 
-  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58307B54) (tstamp 58FDEFE4)
+  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF5544) (tstamp 58FDEFE4)
     (at 156.495 119.315 270)
     (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
     (tags "resistor 0805")
     (path /58FDCDBF)
     (attr smd)
-    (fp_text reference R5 (at 0 -2.1 270) (layer F.SilkS)
+    (fp_text reference R5 (at 2.605 0.031 360) (layer F.SilkS)
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value 10k (at 0 2.1 270) (layer F.Fab)
@@ -831,13 +843,13 @@
     )
   )
 
-  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58307B54) (tstamp 58FDEFE9)
+  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF53CF) (tstamp 58FDEFE9)
     (at 148.605 119.315 270)
     (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
     (tags "resistor 0805")
     (path /58FE9210)
     (attr smd)
-    (fp_text reference R6 (at 0 -2.1 270) (layer F.SilkS)
+    (fp_text reference R6 (at 2.605 0.015 360) (layer F.SilkS)
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value 10k (at 0 2.1 270) (layer F.Fab)
@@ -864,13 +876,13 @@
     )
   )
 
-  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58307B54) (tstamp 58FDEFEE)
+  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF53DA) (tstamp 58FDEFEE)
     (at 144.795 119.315 270)
     (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
     (tags "resistor 0805")
     (path /58FE9204)
     (attr smd)
-    (fp_text reference R7 (at 0 -2.1 270) (layer F.SilkS)
+    (fp_text reference R7 (at 2.605 0.015 360) (layer F.SilkS)
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value 100k (at 0 2.1 270) (layer F.Fab)
@@ -897,13 +909,13 @@
     )
   )
 
-  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58307B54) (tstamp 58FDEFF3)
+  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF53E9) (tstamp 58FDEFF3)
     (at 138.445 119.315 270)
     (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
     (tags "resistor 0805")
     (path /58FE91F8)
     (attr smd)
-    (fp_text reference R8 (at 0 -2.1 270) (layer F.SilkS)
+    (fp_text reference R8 (at 2.605 0.015 360) (layer F.SilkS)
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value 1M (at 0 2.1 270) (layer F.Fab)
@@ -930,13 +942,13 @@
     )
   )
 
-  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58307B54) (tstamp 58FDEFF8)
+  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF53F5) (tstamp 58FDEFF8)
     (at 132.095 119.315 270)
     (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
     (tags "resistor 0805")
     (path /58FE91EC)
     (attr smd)
-    (fp_text reference R9 (at 0 -2.1 270) (layer F.SilkS)
+    (fp_text reference R9 (at 2.605 0.015 360) (layer F.SilkS)
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value 10M (at 0 2.1 270) (layer F.Fab)
@@ -963,13 +975,13 @@
     )
   )
 
-  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58307B54) (tstamp 58FE111C)
+  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF55A0) (tstamp 58FE111C)
     (at 181.895 119.315 270)
     (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
     (tags "resistor 0805")
     (path /58FDC56B)
     (attr smd)
-    (fp_text reference C1 (at 0 -2.1 270) (layer F.SilkS)
+    (fp_text reference C1 (at 2.351 0.031 360) (layer F.SilkS)
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value 1p (at 0 2.1 270) (layer F.Fab)
@@ -996,13 +1008,13 @@
     )
   )
 
-  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58307B54) (tstamp 58FE1121)
+  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF558A) (tstamp 58FE1121)
     (at 178.085 119.315 270)
     (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
     (tags "resistor 0805")
     (path /58FDCBC9)
     (attr smd)
-    (fp_text reference C2 (at 0 -2.1 270) (layer F.SilkS)
+    (fp_text reference C2 (at 2.351 0.031 360) (layer F.SilkS)
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value 10p (at 0 2.1 270) (layer F.Fab)
@@ -1029,13 +1041,13 @@
     )
   )
 
-  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58307B54) (tstamp 58FE1126)
+  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF557E) (tstamp 58FE1126)
     (at 171.735 119.315 270)
     (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
     (tags "resistor 0805")
     (path /58FDCCAD)
     (attr smd)
-    (fp_text reference C3 (at 0 -2.1 270) (layer F.SilkS)
+    (fp_text reference C3 (at 2.605 0.031 360) (layer F.SilkS)
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value 100p (at 0 2.1 270) (layer F.Fab)
@@ -1062,13 +1074,13 @@
     )
   )
 
-  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58307B54) (tstamp 58FE112B)
+  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF5572) (tstamp 58FE112B)
     (at 165.385 119.315 270)
     (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
     (tags "resistor 0805")
     (path /58FDCD1C)
     (attr smd)
-    (fp_text reference C4 (at 0 -2.1 270) (layer F.SilkS)
+    (fp_text reference C4 (at 2.605 0.031 360) (layer F.SilkS)
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value 1n (at 0 2.1 270) (layer F.Fab)
@@ -1095,13 +1107,13 @@
     )
   )
 
-  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58307B54) (tstamp 58FE1130)
+  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF554A) (tstamp 58FE1130)
     (at 159.035 119.315 270)
     (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
     (tags "resistor 0805")
     (path /58FDCDC5)
     (attr smd)
-    (fp_text reference C5 (at 0 -2.1 270) (layer F.SilkS)
+    (fp_text reference C5 (at 2.605 0.031 360) (layer F.SilkS)
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value 10n (at 0 2.1 270) (layer F.Fab)
@@ -1128,13 +1140,13 @@
     )
   )
 
-  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58307B54) (tstamp 58FE1135)
+  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF53C5) (tstamp 58FE1135)
     (at 151.145 119.315 270)
     (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
     (tags "resistor 0805")
     (path /58FE9216)
     (attr smd)
-    (fp_text reference C6 (at 0 -2.1 270) (layer F.SilkS)
+    (fp_text reference C6 (at 2.605 0.015 360) (layer F.SilkS)
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value 10n (at 0 2.1 270) (layer F.Fab)
@@ -1161,13 +1173,13 @@
     )
   )
 
-  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58307B54) (tstamp 58FE113A)
+  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF53E0) (tstamp 58FE113A)
     (at 142.255 119.315 270)
     (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
     (tags "resistor 0805")
     (path /58FE920A)
     (attr smd)
-    (fp_text reference C7 (at 0 -2.1 270) (layer F.SilkS)
+    (fp_text reference C7 (at 2.605 0.015 360) (layer F.SilkS)
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value 1n (at 0 2.1 270) (layer F.Fab)
@@ -1194,13 +1206,13 @@
     )
   )
 
-  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58307B54) (tstamp 58FE113F)
+  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF53EE) (tstamp 58FE113F)
     (at 135.905 119.315 270)
     (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
     (tags "resistor 0805")
     (path /58FE91FE)
     (attr smd)
-    (fp_text reference C8 (at 0 -2.1 270) (layer F.SilkS)
+    (fp_text reference C8 (at 2.605 0.015 360) (layer F.SilkS)
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value 100p (at 0 2.1 270) (layer F.Fab)
@@ -1227,13 +1239,13 @@
     )
   )
 
-  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58307B54) (tstamp 58FE1144)
+  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF53FD) (tstamp 58FE1144)
     (at 129.555 119.315 270)
     (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
     (tags "resistor 0805")
     (path /58FE91F2)
     (attr smd)
-    (fp_text reference C9 (at 0 -2.1 270) (layer F.SilkS)
+    (fp_text reference C9 (at 2.605 0.015 360) (layer F.SilkS)
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value 10p (at 0 2.1 270) (layer F.Fab)
@@ -1260,13 +1272,13 @@
     )
   )
 
-  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58307B54) (tstamp 58FE1149)
+  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF5408) (tstamp 58FE1149)
     (at 125.745 119.315 270)
     (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
     (tags "resistor 0805")
     (path /58FE91E0)
     (attr smd)
-    (fp_text reference C10 (at 0 -2.1 270) (layer F.SilkS)
+    (fp_text reference C10 (at 2.605 0.015 360) (layer F.SilkS)
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value 1p (at 0 2.1 270) (layer F.Fab)
@@ -1293,13 +1305,13 @@
     )
   )
 
-  (module SMD_Packages:SOIC-8-N (layer F.Cu) (tedit 0) (tstamp 58FE285D)
+  (module SMD_Packages:SOIC-8-N (layer F.Cu) (tedit 58FF2673) (tstamp 58FE285D)
     (at 136.398 97.028 270)
     (descr "Module Narrow CMS SOJ 8 pins large")
     (tags "CMS SOJ")
     (path /58FDBB28)
     (attr smd)
-    (fp_text reference U1 (at 0 -1.27 270) (layer F.SilkS)
+    (fp_text reference U1 (at -3.81 1.524 360) (layer F.SilkS)
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value AD8616 (at 0 1.27 270) (layer F.Fab)
@@ -1335,11 +1347,11 @@
     )
   )
 
-  (module Mounting_Holes:MountingHole_3.2mm_M3_Pad (layer F.Cu) (tedit 56D1B4CB) (tstamp 58FE333D)
+  (module Mounting_Holes:MountingHole_3.2mm_M3_Pad (layer F.Cu) (tedit 58FF564A) (tstamp 58FE333D)
     (at 112 86)
     (descr "Mounting Hole 3.2mm, M3")
     (tags "mounting hole 3.2mm m3")
-    (fp_text reference REF** (at 0 -4.2) (layer F.SilkS)
+    (fp_text reference REF** (at 0 -4.2) (layer F.SilkS) hide
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value MountingHole_3.2mm_M3_Pad (at 0 4.2) (layer F.Fab)
@@ -1350,11 +1362,11 @@
     (pad 1 thru_hole circle (at 0 0) (size 6.4 6.4) (drill 3.2) (layers *.Cu *.Mask))
   )
 
-  (module Mounting_Holes:MountingHole_3.2mm_M3_Pad (layer F.Cu) (tedit 56D1B4CB) (tstamp 58FE3349)
+  (module Mounting_Holes:MountingHole_3.2mm_M3_Pad (layer F.Cu) (tedit 58FF5641) (tstamp 58FE3349)
     (at 112 126)
     (descr "Mounting Hole 3.2mm, M3")
     (tags "mounting hole 3.2mm m3")
-    (fp_text reference REF** (at 0 -4.2) (layer F.SilkS)
+    (fp_text reference REF** (at 0 -4.2) (layer F.SilkS) hide
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value MountingHole_3.2mm_M3_Pad (at 0 4.2) (layer F.Fab)
@@ -1365,11 +1377,11 @@
     (pad 1 thru_hole circle (at 0 0) (size 6.4 6.4) (drill 3.2) (layers *.Cu *.Mask))
   )
 
-  (module Mounting_Holes:MountingHole_3.2mm_M3_Pad (layer F.Cu) (tedit 56D1B4CB) (tstamp 58FE3366)
+  (module Mounting_Holes:MountingHole_3.2mm_M3_Pad (layer F.Cu) (tedit 58FF5638) (tstamp 58FE3366)
     (at 182 86)
     (descr "Mounting Hole 3.2mm, M3")
     (tags "mounting hole 3.2mm m3")
-    (fp_text reference REF** (at 0 -4.2) (layer F.SilkS)
+    (fp_text reference REF** (at 0 -4.2) (layer F.SilkS) hide
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value MountingHole_3.2mm_M3_Pad (at 0 4.2) (layer F.Fab)
@@ -1380,10 +1392,10 @@
     (pad 1 thru_hole circle (at 0 0) (size 6.4 6.4) (drill 3.2) (layers *.Cu *.Mask))
   )
 
-  (module Testpoints:TP_SMD_quadr_3mm (layer F.Cu) (tedit 58FF0D14) (tstamp 58FFB0B5)
+  (module Testpoints:TP_SMD_quadr_3mm (layer F.Cu) (tedit 58FF5625) (tstamp 58FFB0B5)
     (at 173.482 128.27)
     (path /58FE3886)
-    (fp_text reference TP1 (at 0 2.54) (layer F.SilkS)
+    (fp_text reference TP1 (at 3.302 0) (layer F.SilkS)
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value TEST (at 0 -2.54) (layer F.Fab)
@@ -1393,10 +1405,10 @@
       (net 7 "Net-(P4-Pad1)"))
   )
 
-  (module Testpoints:TP_SMD_quadr_3mm (layer F.Cu) (tedit 58FF0D14) (tstamp 58FFB0B9)
+  (module Testpoints:TP_SMD_quadr_3mm (layer F.Cu) (tedit 58FF266A) (tstamp 58FFB0B9)
     (at 139.7 91.694)
     (path /58FEC254)
-    (fp_text reference TP2 (at 0 2.54) (layer F.SilkS)
+    (fp_text reference TP2 (at 0 -3.302) (layer F.SilkS)
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value TEST (at 0 -2.54) (layer F.Fab)
@@ -1419,10 +1431,10 @@
       (net 9 GND))
   )
 
-  (module Testpoints:TP_SMD_quadr_3mm (layer F.Cu) (tedit 58FF0D14) (tstamp 58FFB0C2)
+  (module Testpoints:TP_SMD_quadr_3mm (layer F.Cu) (tedit 58FF561C) (tstamp 58FFB0C2)
     (at 133.604 128.27)
     (path /58FE922E)
-    (fp_text reference TP4 (at 0 2.54) (layer F.SilkS)
+    (fp_text reference TP4 (at -3.556 0) (layer F.SilkS)
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value TEST (at 0 -2.54) (layer F.Fab)
@@ -1432,18 +1444,6 @@
       (net 17 "Net-(P5-Pad1)"))
   )
 
-  (module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF196A) (tstamp 58FFB7B9)
-    (at 127.762 122.936)
-    (fp_text reference REF** (at 0 -3.81) (layer F.SilkS)
-      (effects (font (size 1 1) (thickness 0.15)))
-    )
-    (fp_text value SolderWirePad_single_1mmDrill (at -1.905 3.175) (layer F.Fab)
-      (effects (font (size 1 1) (thickness 0.15)))
-    )
-    (pad 1 thru_hole circle (at 0 0) (size 2.49936 2.49936) (drill 1.00076) (layers *.Cu)
-      (net 9 GND))
-  )
-
   (dimension 20 (width 0.3) (layer Dwgs.User)
     (gr_text "20,000 mm" (at 117 69.65) (layer Dwgs.User)
       (effects (font (size 1.5 1.5) (thickness 0.3)))