Created gerber files.

etching/part_list.csv

@@ -13,3 +13,5 @@ PCB drillers, http://www.ebay.de/itm/10tlg-Micro-Bohrer-Platinenbohrer-Spiralboh
 Feric chloride, http://de.farnell.com/cif/ar371/eisenchloridgranulat-kanister/dp/1783550 , 15.3 €
 Canister, ?, ?   
 NaOH (positive developer), http://de.farnell.com/cif/ar45/entwickler-f-r-leiterplatten/dp/4208547, 2 €
+Developing tray, http://www.ebay.de/itm/SET-MIT-3-DRUCK-ENTWICKLUNG-TABLETTS-25-4cmX20-3cm-DUNKELKAMMER-SCHALE-25CM-X/192088937353?_trksid=p2047675.c100005.m1851&_trkparms=aid%3D222007%26algo%3DSIC.MBE%26ao%3D2%26asc%3D43784%26meid%3De0b0c5f119904128a75722cfa1273e33%26pid%3D100005%26rk%3D5%26rkt%3D6%26sd%3D292074724680, 25 €
+Copper wire, https://www.aliexpress.com/item/0-3-0-4-0-6-0-8mm-Plated-Copper-Wire-Beads-Jewelry-Making-Accessories-DIY/32793573568.html?spm=2114.01010208.3.35.kNJGsC&ws_ab_test=searchweb0_0,searchweb201602_2_10152_10065_10151_10068_436_10136_10137_10157_10060_10138_10155_10062_10156_10154_10056_10055_10054_10059_10099_10103_10102_10096_10052_10053_10142_10107_10050_10051_10171_10084_10083_10080_10082_10081_10110_10111_10112_10113_10114_10181_10183_10182_10078_10079_10073_10070_10123-normal#cfs,searchweb201603_9,ppcSwitch_2&btsid=b6736001-587b-45eb-8588-43bf3b075005&algo_expid=fc88b114-f514-40ea-883e-904dcf80c951-4&algo_pvid=fc88b114-f514-40ea-883e-904dcf80c951, ~ 5 € 

pcbs/transimpedance_amp/Vias.pretty/Stitchging-Via-0.6.kicad_mod

@@ -0,0 +1,10 @@
+(module Stitchging-Via-0.6 (layer F.Cu) (tedit 590A0DDF)
+  (fp_text reference REF** (at 0 1.27) (layer F.SilkS) hide
+    (effects (font (size 1 1) (thickness 0.15)))
+  )
+  (fp_text value Stitching-Via-0.6 (at 0 -1.27) (layer F.Fab)
+    (effects (font (size 1 1) (thickness 0.15)))
+  )
+  (pad 1 thru_hole circle (at 0 0) (size 0.6 0.6) (drill 0.3) (layers *.Cu)
+    (zone_connect 2))
+)

pcbs/transimpedance_amp/gerberv1/transimpedance_amp-B.CrtYd.gbr

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pcbs/transimpedance_amp/gerberv1/transimpedance_amp-B.Mask.gbr

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pcbs/transimpedance_amp/gerberv1/transimpedance_amp-B.SilkS.gbr

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pcbs/transimpedance_amp/gerberv1/transimpedance_amp-Edge.Cuts.gbr

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pcbs/transimpedance_amp/gerberv1/transimpedance_amp-F.CrtYd.gbr

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pcbs/transimpedance_amp/gerberv1/transimpedance_amp-F.Mask.gbr

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pcbs/transimpedance_amp/gerberv1/transimpedance_amp.drl

@@ -0,0 +1,101 @@
+M48
+;DRILL file {KiCad 4.0.5+dfsg1-4} date Wed May  3 19:23:39 2017
+;FORMAT={-:-/ absolute / inch / decimal}
+FMAT,2
+INCH,TZ
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pcbs/transimpedance_amp/transimpedance_amp.kicad_pcb

@@ -1,18 +1,25 @@
 (kicad_pcb (version 4) (host pcbnew 4.0.5+dfsg1-4)
 
   (general
-    (links 87)
+    (links 101)
     (no_connects 0)
-    (area 106.899999 80.899999 187.100001 131.100001)
+    (area 85.400287 67.38 246.831715 146.638001)
     (thickness 1.6)
-    (drawings 10)
+    (drawings 18)
     (tracks 203)
     (zones 0)
-    (modules 48)
+    (modules 62)
     (nets 19)
   )
 
   (page A4)
+  (title_block
+    (title "Transimpedance Amplifier")
+    (date 2017-05-03)
+    (rev 1)
+    (company "Uppsala University")
+  )
+
   (layers
     (0 F.Cu signal)
     (31 B.Cu signal)
@@ -37,7 +44,7 @@
   )
 
   (setup
-    (last_trace_width 0.5)
+    (last_trace_width 0.25)
     (user_trace_width 0.5)
     (trace_clearance 0.2)
     (zone_clearance 0.3)
@@ -67,7 +74,7 @@
     (grid_origin 137.16 92.964)
     (visible_elements FFFEFF7F)
     (pcbplotparams
-      (layerselection 0x00030_80000001)
+      (layerselection 0x0d1f0_80000001)
       (usegerberextensions false)
       (excludeedgelayer true)
       (linewidth 0.100000)
@@ -88,9 +95,9 @@
       (subtractmaskfromsilk false)
       (outputformat 1)
       (mirror false)
-      (drillshape 1)
+      (drillshape 0)
       (scaleselection 1)
-      (outputdirectory ""))
+      (outputdirectory gerberv1/))
   )
 
   (net 0 "")
@@ -140,100 +147,148 @@
     (add_net "Net-(P7-Pad1)")
   )
 
-  (module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF5630) (tstamp 59071338)
-    (at 168.402 116.332)
-    (fp_text reference REF** (at 0 -3.81) (layer F.SilkS) hide
+  (module Vias:Stitchging-Via-0.6 (layer F.Cu) (tedit 590A0DDF) (tstamp 590A0FE8)
+    (at 174.117 107.188)
+    (fp_text reference REF** (at 0 1.27) (layer F.SilkS) hide
       (effects (font (size 1 1) (thickness 0.15)))
     )
-    (fp_text value SolderWirePad_single_1mmDrill (at -1.905 3.175) (layer F.Fab)
+    (fp_text value SolderWirePad_single_1mmDrill (at 0 -1.27) (layer F.Fab)
       (effects (font (size 1 1) (thickness 0.15)))
     )
-    (pad 1 thru_hole circle (at 0 0) (size 2.49936 2.49936) (drill 1.00076) (layers *.Cu)
-      (net 8 GND))
+    (pad 1 thru_hole circle (at 0 0) (size 0.6 0.6) (drill 0.3) (layers *.Cu)
+      (net 8 GND) (zone_connect 2))
   )
 
-  (module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF5630) (tstamp 590712DE)
-    (at 168.148 90.17)
-    (fp_text reference REF** (at 0 -3.81) (layer F.SilkS) hide
+  (module Vias:Stitchging-Via-0.6 (layer F.Cu) (tedit 590A0DDF) (tstamp 590A0F15)
+    (at 173.228 114.427)
+    (fp_text reference REF** (at 0 1.27) (layer F.SilkS) hide
       (effects (font (size 1 1) (thickness 0.15)))
     )
-    (fp_text value SolderWirePad_single_1mmDrill (at -1.905 3.175) (layer F.Fab)
+    (fp_text value SolderWirePad_single_1mmDrill (at 0 -1.27) (layer F.Fab)
       (effects (font (size 1 1) (thickness 0.15)))
     )
-    (pad 1 thru_hole circle (at 0 0) (size 2.49936 2.49936) (drill 1.00076) (layers *.Cu)
-      (net 8 GND))
+    (pad 1 thru_hole circle (at 0 0) (size 0.6 0.6) (drill 0.3) (layers *.Cu)
+      (net 8 GND) (zone_connect 2))
   )
 
-  (module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF5630) (tstamp 59071272)
-    (at 153.924 100.838)
-    (fp_text reference REF** (at 0 -3.81) (layer F.SilkS) hide
+  (module Vias:Stitchging-Via-0.6 (layer F.Cu) (tedit 590A0DDF) (tstamp 590A0F10)
+    (at 175.641 116.84)
+    (fp_text reference REF** (at 0 1.27) (layer F.SilkS) hide
       (effects (font (size 1 1) (thickness 0.15)))
     )
-    (fp_text value SolderWirePad_single_1mmDrill (at -1.905 3.175) (layer F.Fab)
+    (fp_text value SolderWirePad_single_1mmDrill (at 0 -1.27) (layer F.Fab)
       (effects (font (size 1 1) (thickness 0.15)))
     )
-    (pad 1 thru_hole circle (at 0 0) (size 2.49936 2.49936) (drill 1.00076) (layers *.Cu)
-      (net 8 GND))
+    (pad 1 thru_hole circle (at 0 0) (size 0.6 0.6) (drill 0.3) (layers *.Cu)
+      (net 8 GND) (zone_connect 2))
   )
 
-  (module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF5630) (tstamp 59071268)
-    (at 159.512 101.092)
-    (fp_text reference REF** (at 0 -3.81) (layer F.SilkS) hide
+  (module Vias:Stitchging-Via-0.6 (layer F.Cu) (tedit 590A0DDF) (tstamp 590A0F0B)
+    (at 165.862 120.015)
+    (fp_text reference REF** (at 0 1.27) (layer F.SilkS) hide
       (effects (font (size 1 1) (thickness 0.15)))
     )
-    (fp_text value SolderWirePad_single_1mmDrill (at -1.905 3.175) (layer F.Fab)
+    (fp_text value SolderWirePad_single_1mmDrill (at 0 -1.27) (layer F.Fab)
       (effects (font (size 1 1) (thickness 0.15)))
     )
-    (pad 1 thru_hole circle (at 0 0) (size 2.49936 2.49936) (drill 1.00076) (layers *.Cu)
-      (net 8 GND))
+    (pad 1 thru_hole circle (at 0 0) (size 0.6 0.6) (drill 0.3) (layers *.Cu)
+      (net 8 GND) (zone_connect 2))
   )
 
-  (module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF5630) (tstamp 5907122A)
-    (at 148.59 98.298)
-    (fp_text reference REF** (at 0 -3.81) (layer F.SilkS) hide
+  (module Vias:Stitchging-Via-0.6 (layer F.Cu) (tedit 590A0DDF) (tstamp 590A0F06)
+    (at 146.812 109.855)
+    (fp_text reference REF** (at 0 1.27) (layer F.SilkS) hide
       (effects (font (size 1 1) (thickness 0.15)))
     )
-    (fp_text value SolderWirePad_single_1mmDrill (at -1.905 3.175) (layer F.Fab)
+    (fp_text value SolderWirePad_single_1mmDrill (at 0 -1.27) (layer F.Fab)
       (effects (font (size 1 1) (thickness 0.15)))
     )
-    (pad 1 thru_hole circle (at 0 0) (size 2.49936 2.49936) (drill 1.00076) (layers *.Cu)
-      (net 8 GND))
+    (pad 1 thru_hole circle (at 0 0) (size 0.6 0.6) (drill 0.3) (layers *.Cu)
+      (net 8 GND) (zone_connect 2))
   )
 
-  (module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF5630) (tstamp 5907121D)
-    (at 160.274 123.444)
-    (fp_text reference REF** (at 0 -3.81) (layer F.SilkS) hide
+  (module Vias:Stitchging-Via-0.6 (layer F.Cu) (tedit 590A0DDF) (tstamp 590A0F01)
+    (at 139.319 117.983)
+    (fp_text reference REF** (at 0 1.27) (layer F.SilkS) hide
       (effects (font (size 1 1) (thickness 0.15)))
     )
-    (fp_text value SolderWirePad_single_1mmDrill (at -1.905 3.175) (layer F.Fab)
+    (fp_text value SolderWirePad_single_1mmDrill (at 0 -1.27) (layer F.Fab)
       (effects (font (size 1 1) (thickness 0.15)))
     )
-    (pad 1 thru_hole circle (at 0 0) (size 2.49936 2.49936) (drill 1.00076) (layers *.Cu)
-      (net 8 GND))
+    (pad 1 thru_hole circle (at 0 0) (size 0.6 0.6) (drill 0.3) (layers *.Cu)
+      (net 8 GND) (zone_connect 2))
   )
 
-  (module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF5630) (tstamp 5907120F)
-    (at 155.448 122.682)
-    (fp_text reference REF** (at 0 -3.81) (layer F.SilkS) hide
+  (module Vias:Stitchging-Via-0.6 (layer F.Cu) (tedit 590A0DDF) (tstamp 590A0EFC)
+    (at 123.952 124.333)
+    (fp_text reference REF** (at 0 1.27) (layer F.SilkS) hide
       (effects (font (size 1 1) (thickness 0.15)))
     )
-    (fp_text value SolderWirePad_single_1mmDrill (at -1.905 3.175) (layer F.Fab)
+    (fp_text value SolderWirePad_single_1mmDrill (at 0 -1.27) (layer F.Fab)
       (effects (font (size 1 1) (thickness 0.15)))
     )
-    (pad 1 thru_hole circle (at 0 0) (size 2.49936 2.49936) (drill 1.00076) (layers *.Cu)
-      (net 8 GND))
+    (pad 1 thru_hole circle (at 0 0) (size 0.6 0.6) (drill 0.3) (layers *.Cu)
+      (net 8 GND) (zone_connect 2))
   )
 
-  (module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF5630) (tstamp 59071201)
-    (at 147.828 119.888)
-    (fp_text reference REF** (at 0 -3.81) (layer F.SilkS) hide
+  (module Vias:Stitchging-Via-0.6 (layer F.Cu) (tedit 590A0DDF) (tstamp 590A0EF6)
+    (at 118.872 90.17)
+    (fp_text reference REF** (at 0 1.27) (layer F.SilkS) hide
       (effects (font (size 1 1) (thickness 0.15)))
     )
-    (fp_text value SolderWirePad_single_1mmDrill (at -1.905 3.175) (layer F.Fab)
+    (fp_text value SolderWirePad_single_1mmDrill (at 0 -1.27) (layer F.Fab)
       (effects (font (size 1 1) (thickness 0.15)))
     )
-    (pad 1 thru_hole circle (at 0 0) (size 2.49936 2.49936) (drill 1.00076) (layers *.Cu)
-      (net 8 GND))
+    (pad 1 thru_hole circle (at 0 0) (size 0.6 0.6) (drill 0.3) (layers *.Cu)
+      (net 8 GND) (zone_connect 2))
+  )
+
+  (module Vias:Stitchging-Via-0.6 (layer F.Cu) (tedit 590A0DDF) (tstamp 590A0EF1)
+    (at 123.698 108.712)
+    (fp_text reference REF** (at 0 1.27) (layer F.SilkS) hide
+      (effects (font (size 1 1) (thickness 0.15)))
+    )
+    (fp_text value SolderWirePad_single_1mmDrill (at 0 -1.27) (layer F.Fab)
+      (effects (font (size 1 1) (thickness 0.15)))
+    )
+    (pad 1 thru_hole circle (at 0 0) (size 0.6 0.6) (drill 0.3) (layers *.Cu)
+      (net 8 GND) (zone_connect 2))
+  )
+
+  (module Vias:Stitchging-Via-0.6 (layer F.Cu) (tedit 590A0DDF) (tstamp 590A0EE7)
+    (at 146.685 97.028)
+    (fp_text reference REF** (at 0 1.27) (layer F.SilkS) hide
+      (effects (font (size 1 1) (thickness 0.15)))
+    )
+    (fp_text value SolderWirePad_single_1mmDrill (at 0 -1.27) (layer F.Fab)
+      (effects (font (size 1 1) (thickness 0.15)))
+    )
+    (pad 1 thru_hole circle (at 0 0) (size 0.6 0.6) (drill 0.3) (layers *.Cu)
+      (net 8 GND) (zone_connect 2))
+  )
+
+  (module Vias:Stitchging-Via-0.6 (layer F.Cu) (tedit 590A0DDF) (tstamp 590A0EE2)
+    (at 166.624 97.917)
+    (fp_text reference REF** (at 0 1.27) (layer F.SilkS) hide
+      (effects (font (size 1 1) (thickness 0.15)))
+    )
+    (fp_text value SolderWirePad_single_1mmDrill (at 0 -1.27) (layer F.Fab)
+      (effects (font (size 1 1) (thickness 0.15)))
+    )
+    (pad 1 thru_hole circle (at 0 0) (size 0.6 0.6) (drill 0.3) (layers *.Cu)
+      (net 8 GND) (zone_connect 2))
+  )
+
+  (module Vias:Stitchging-Via-0.6 (layer F.Cu) (tedit 590A0DDF) (tstamp 590A0EDD)
+    (at 173.99 84.836)
+    (fp_text reference REF** (at 0 1.27) (layer F.SilkS) hide
+      (effects (font (size 1 1) (thickness 0.15)))
+    )
+    (fp_text value SolderWirePad_single_1mmDrill (at 0 -1.27) (layer F.Fab)
+      (effects (font (size 1 1) (thickness 0.15)))
+    )
+    (pad 1 thru_hole circle (at 0 0) (size 0.6 0.6) (drill 0.3) (layers *.Cu)
+      (net 8 GND) (zone_connect 2))
   )
 
   (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58FF5544) (tstamp 58FDEFE4)
@@ -269,18 +324,6 @@
     )
   )
 
-  (module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 58FF5630) (tstamp 58FFB7ED)
-    (at 112.014 103.886)
-    (fp_text reference REF** (at 0 -3.81) (layer F.SilkS) hide
-      (effects (font (size 1 1) (thickness 0.15)))
-    )
-    (fp_text value SolderWirePad_single_1mmDrill (at -1.905 3.175) (layer F.Fab)
-      (effects (font (size 1 1) (thickness 0.15)))
-    )
-    (pad 1 thru_hole circle (at 0 0) (size 2.49936 2.49936) (drill 1.00076) (layers *.Cu)
-      (net 8 GND))
-  )
-
   (module Mounting_Holes:MountingHole_3.2mm_M3_Pad (layer F.Cu) (tedit 58FF5599) (tstamp 58FF0A6E)
     (at 182 126)
     (descr "Mounting Hole 3.2mm, M3")
@@ -1359,10 +1402,10 @@
     (pad 1 thru_hole circle (at 0 0) (size 6.4 6.4) (drill 3.2) (layers *.Cu *.Mask))
   )
 
-  (module Testpoints:TP_SMD_quadr_3mm (layer F.Cu) (tedit 59071373) (tstamp 58FFB0B5)
+  (module Testpoints:TP_SMD_quadr_3mm (layer F.Cu) (tedit 590A0B36) (tstamp 58FFB0B5)
     (at 184.658 104.394)
     (path /58FE3886)
-    (fp_text reference TP1 (at 0.254 -2.286) (layer F.SilkS)
+    (fp_text reference TP1 (at 0 -2.921) (layer F.SilkS)
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value TEST (at 0 -2.54) (layer F.Fab)
@@ -1372,10 +1415,10 @@
       (net 7 "Net-(P4-Pad1)"))
   )
 
-  (module Testpoints:TP_SMD_quadr_3mm (layer F.Cu) (tedit 590713A0) (tstamp 58FFB0B9)
+  (module Testpoints:TP_SMD_quadr_3mm (layer F.Cu) (tedit 590A0BAF) (tstamp 58FFB0B9)
     (at 136.652 85.344)
     (path /58FEC254)
-    (fp_text reference TP2 (at 0 -2.54) (layer F.SilkS)
+    (fp_text reference 5V (at 0 -2.54) (layer F.SilkS)
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value TEST (at 0 -2.54) (layer F.Fab)
@@ -1385,10 +1428,10 @@
       (net 9 +5V))
   )
 
-  (module Testpoints:TP_SMD_quadr_3mm (layer F.Cu) (tedit 58FF0D14) (tstamp 58FFB0C1)
+  (module Testpoints:TP_SMD_quadr_3mm (layer F.Cu) (tedit 590A0BBA) (tstamp 58FFB0C1)
     (at 112.014 95.25)
     (path /58FF116B)
-    (fp_text reference TP3 (at 0 2.54) (layer F.SilkS)
+    (fp_text reference GND (at 0 2.54) (layer F.SilkS)
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value TEST (at 0 -2.54) (layer F.Fab)
@@ -1398,10 +1441,10 @@
       (net 8 GND))
   )
 
-  (module Testpoints:TP_SMD_quadr_3mm (layer F.Cu) (tedit 5907137B) (tstamp 58FFB0C2)
+  (module Testpoints:TP_SMD_quadr_3mm (layer F.Cu) (tedit 590A0B39) (tstamp 58FFB0C2)
     (at 184.658 109.982)
     (path /58FE922E)
-    (fp_text reference TP4 (at 0.508 2.54) (layer F.SilkS)
+    (fp_text reference TP4 (at 0.127 2.921) (layer F.SilkS)
       (effects (font (size 1 1) (thickness 0.15)))
     )
     (fp_text value TEST (at 0 -2.54) (layer F.Fab)
@@ -1444,6 +1487,198 @@
     )
   )
 
+  (module Vias:Stitchging-Via-0.6 (layer F.Cu) (tedit 590A0DDF) (tstamp 590A0C8B)
+    (at 130.048 96.774)
+    (fp_text reference REF** (at 0 1.27) (layer F.SilkS) hide
+      (effects (font (size 1 1) (thickness 0.15)))
+    )
+    (fp_text value SolderWirePad_single_1mmDrill (at 0 -1.27) (layer F.Fab)
+      (effects (font (size 1 1) (thickness 0.15)))
+    )
+    (pad 1 thru_hole circle (at 0 0) (size 0.6 0.6) (drill 0.3) (layers *.Cu)
+      (net 8 GND) (zone_connect 2))
+  )
+
+  (module Vias:Stitchging-Via-0.6 (layer F.Cu) (tedit 590A0DDF) (tstamp 590A0A3B)
+    (at 155.702 84.836)
+    (fp_text reference REF** (at 0 1.27) (layer F.SilkS) hide
+      (effects (font (size 1 1) (thickness 0.15)))
+    )
+    (fp_text value SolderWirePad_single_1mmDrill (at 0 -1.27) (layer F.Fab)
+      (effects (font (size 1 1) (thickness 0.15)))
+    )
+    (pad 1 thru_hole circle (at 0 0) (size 0.6 0.6) (drill 0.3) (layers *.Cu)
+      (net 8 GND) (zone_connect 2))
+  )
+
+  (module Vias:Stitchging-Via-0.6 (layer F.Cu) (tedit 590A0DDF) (tstamp 59071338)
+    (at 168.402 116.332)
+    (fp_text reference REF** (at 0 1.27) (layer F.SilkS) hide
+      (effects (font (size 1 1) (thickness 0.15)))
+    )
+    (fp_text value SolderWirePad_single_1mmDrill (at 0 -1.27) (layer F.Fab)
+      (effects (font (size 1 1) (thickness 0.15)))
+    )
+    (pad 1 thru_hole circle (at 0 0) (size 0.6 0.6) (drill 0.3) (layers *.Cu)
+      (net 8 GND) (zone_connect 2))
+  )
+
+  (module Vias:Stitchging-Via-0.6 (layer F.Cu) (tedit 590A0DDF) (tstamp 590712DE)
+    (at 168.148 90.17)
+    (fp_text reference REF** (at 0 1.27) (layer F.SilkS) hide
+      (effects (font (size 1 1) (thickness 0.15)))
+    )
+    (fp_text value SolderWirePad_single_1mmDrill (at 0 -1.27) (layer F.Fab)
+      (effects (font (size 1 1) (thickness 0.15)))
+    )
+    (pad 1 thru_hole circle (at 0 0) (size 0.6 0.6) (drill 0.3) (layers *.Cu)
+      (net 8 GND) (zone_connect 2))
+  )
+
+  (module Vias:Stitchging-Via-0.6 (layer F.Cu) (tedit 590A0DDF) (tstamp 59071272)
+    (at 153.924 100.838)
+    (fp_text reference REF** (at 0 1.27) (layer F.SilkS) hide
+      (effects (font (size 1 1) (thickness 0.15)))
+    )
+    (fp_text value SolderWirePad_single_1mmDrill (at 0 -1.27) (layer F.Fab)
+      (effects (font (size 1 1) (thickness 0.15)))
+    )
+    (pad 1 thru_hole circle (at 0 0) (size 0.6 0.6) (drill 0.3) (layers *.Cu)
+      (net 8 GND) (zone_connect 2))
+  )
+
+  (module Vias:Stitchging-Via-0.6 (layer F.Cu) (tedit 590A0DDF) (tstamp 59071268)
+    (at 159.512 101.092)
+    (fp_text reference REF** (at 0 1.27) (layer F.SilkS) hide
+      (effects (font (size 1 1) (thickness 0.15)))
+    )
+    (fp_text value SolderWirePad_single_1mmDrill (at 0 -1.27) (layer F.Fab)
+      (effects (font (size 1 1) (thickness 0.15)))
+    )
+    (pad 1 thru_hole circle (at 0 0) (size 0.6 0.6) (drill 0.3) (layers *.Cu)
+      (net 8 GND) (zone_connect 2))
+  )
+
+  (module Vias:Stitchging-Via-0.6 (layer F.Cu) (tedit 590A0DDF) (tstamp 5907122A)
+    (at 148.844 100.584)
+    (fp_text reference REF** (at 0 1.27) (layer F.SilkS) hide
+      (effects (font (size 1 1) (thickness 0.15)))
+    )
+    (fp_text value SolderWirePad_single_1mmDrill (at 0 -1.27) (layer F.Fab)
+      (effects (font (size 1 1) (thickness 0.15)))
+    )
+    (pad 1 thru_hole circle (at 0 0) (size 0.6 0.6) (drill 0.3) (layers *.Cu)
+      (net 8 GND) (zone_connect 2))
+  )
+
+  (module Vias:Stitchging-Via-0.6 (layer F.Cu) (tedit 590A0DDF) (tstamp 5907121D)
+    (at 160.274 123.444)
+    (fp_text reference REF** (at 0 1.27) (layer F.SilkS) hide
+      (effects (font (size 1 1) (thickness 0.15)))
+    )
+    (fp_text value SolderWirePad_single_1mmDrill (at 0 -1.27) (layer F.Fab)
+      (effects (font (size 1 1) (thickness 0.15)))
+    )
+    (pad 1 thru_hole circle (at 0 0) (size 0.6 0.6) (drill 0.3) (layers *.Cu)
+      (net 8 GND) (zone_connect 2))
+  )
+
+  (module Vias:Stitchging-Via-0.6 (layer F.Cu) (tedit 590A0DDF) (tstamp 5907120F)
+    (at 155.448 122.682)
+    (fp_text reference REF** (at 0 1.27) (layer F.SilkS) hide
+      (effects (font (size 1 1) (thickness 0.15)))
+    )
+    (fp_text value SolderWirePad_single_1mmDrill (at 0 -1.27) (layer F.Fab)
+      (effects (font (size 1 1) (thickness 0.15)))
+    )
+    (pad 1 thru_hole circle (at 0 0) (size 0.6 0.6) (drill 0.3) (layers *.Cu)
+      (net 8 GND) (zone_connect 2))
+  )
+
+  (module Vias:Stitchging-Via-0.6 (layer F.Cu) (tedit 590A0DDF) (tstamp 59071201)
+    (at 147.828 119.888)
+    (fp_text reference REF** (at 0 1.27) (layer F.SilkS) hide
+      (effects (font (size 1 1) (thickness 0.15)))
+    )
+    (fp_text value SolderWirePad_single_1mmDrill (at 0 -1.27) (layer F.Fab)
+      (effects (font (size 1 1) (thickness 0.15)))
+    )
+    (pad 1 thru_hole circle (at 0 0) (size 0.6 0.6) (drill 0.3) (layers *.Cu)
+      (net 8 GND) (zone_connect 2))
+  )
+
+  (module Vias:Stitchging-Via-0.6 (layer F.Cu) (tedit 590A0DDF) (tstamp 58FFB7ED)
+    (at 112.014 103.886)
+    (fp_text reference REF** (at 0 1.27) (layer F.SilkS) hide
+      (effects (font (size 1 1) (thickness 0.15)))
+    )
+    (fp_text value SolderWirePad_single_1mmDrill (at 0 -1.27) (layer F.Fab)
+      (effects (font (size 1 1) (thickness 0.15)))
+    )
+    (pad 1 thru_hole circle (at 0 0) (size 0.6 0.6) (drill 0.3) (layers *.Cu)
+      (net 8 GND) (zone_connect 2))
+  )
+
+  (gr_text "highest current" (at 138.303 123.444) (layer F.SilkS)
+    (effects (font (size 1.5 1.5) (thickness 0.3)))
+  )
+  (gr_text "highest current" (at 138.43 100.711) (layer F.SilkS)
+    (effects (font (size 1.5 1.5) (thickness 0.3)))
+  )
+  (gr_text "BPW34FA\n" (at 126.619 110.871) (layer F.SilkS)
+    (effects (font (size 1.5 1.5) (thickness 0.3)))
+  )
+  (gr_text "Output of the BPW34 \nis on this side (TP4)." (at 109.982 118.11) (layer F.SilkS)
+    (effects (font (size 1.5 1.5) (thickness 0.3)) (justify left))
+  )
+  (dimension 2.54 (width 0.3) (layer Dwgs.User)
+    (gr_text "2,540 mm" (at 241.046 90.805 270) (layer Dwgs.User)
+      (effects (font (size 1.5 1.5) (thickness 0.3)))
+    )
+    (feature1 (pts (xy 161.925 92.075) (xy 239.174 92.075)))
+    (feature2 (pts (xy 161.925 89.535) (xy 239.174 89.535)))
+    (crossbar (pts (xy 236.474 89.535) (xy 236.474 92.075)))
+    (arrow1a (pts (xy 236.474 92.075) (xy 235.887579 90.948496)))
+    (arrow1b (pts (xy 236.474 92.075) (xy 237.060421 90.948496)))
+    (arrow2a (pts (xy 236.474 89.535) (xy 235.887579 90.661504)))
+    (arrow2b (pts (xy 236.474 89.535) (xy 237.060421 90.661504)))
+  )
+  (dimension 2.54 (width 0.3) (layer Dwgs.User)
+    (gr_text "2,540 mm" (at 180.34 68.58) (layer Dwgs.User)
+      (effects (font (size 1.5 1.5) (thickness 0.3)))
+    )
+    (feature1 (pts (xy 181.61 93.98) (xy 181.61 70.198)))
+    (feature2 (pts (xy 179.07 93.98) (xy 179.07 70.198)))
+    (crossbar (pts (xy 179.07 72.898) (xy 181.61 72.898)))
+    (arrow1a (pts (xy 181.61 72.898) (xy 180.483496 73.484421)))
+    (arrow1b (pts (xy 181.61 72.898) (xy 180.483496 72.311579)))
+    (arrow2a (pts (xy 179.07 72.898) (xy 180.196504 73.484421)))
+    (arrow2b (pts (xy 179.07 72.898) (xy 180.196504 72.311579)))
+  )
+  (dimension 2.54 (width 0.3) (layer Dwgs.User)
+    (gr_text "2,540 mm" (at 180.594 145.288) (layer Dwgs.User)
+      (effects (font (size 1.5 1.5) (thickness 0.3)))
+    )
+    (feature1 (pts (xy 181.61 120.396) (xy 181.61 143.67)))
+    (feature2 (pts (xy 179.07 120.396) (xy 179.07 143.67)))
+    (crossbar (pts (xy 179.07 140.97) (xy 181.61 140.97)))
+    (arrow1a (pts (xy 181.61 140.97) (xy 180.483496 141.556421)))
+    (arrow1b (pts (xy 181.61 140.97) (xy 180.483496 140.383579)))
+    (arrow2a (pts (xy 179.07 140.97) (xy 180.196504 141.556421)))
+    (arrow2b (pts (xy 179.07 140.97) (xy 180.196504 140.383579)))
+  )
+  (dimension 2.54 (width 0.3) (layer Dwgs.User)
+    (gr_text "2,540 mm" (at 91.186 112.522 270) (layer Dwgs.User)
+      (effects (font (size 1.5 1.5) (thickness 0.3)))
+    )
+    (feature1 (pts (xy 152.146 113.792) (xy 92.804 113.792)))
+    (feature2 (pts (xy 152.146 111.252) (xy 92.804 111.252)))
+    (crossbar (pts (xy 95.504 111.252) (xy 95.504 113.792)))
+    (arrow1a (pts (xy 95.504 113.792) (xy 94.917579 112.665496)))
+    (arrow1b (pts (xy 95.504 113.792) (xy 96.090421 112.665496)))
+    (arrow2a (pts (xy 95.504 111.252) (xy 94.917579 112.378504)))
+    (arrow2b (pts (xy 95.504 111.252) (xy 96.090421 112.378504)))
+  )
   (dimension 50.038 (width 0.3) (layer Dwgs.User)
     (gr_text "50,0 mm" (at 219.536 106.045 270) (layer Dwgs.User)
       (effects (font (size 1.5 1.5) (thickness 0.3)))
@@ -1469,7 +1704,7 @@
     (arrow2b (pts (xy 106.934 134.366) (xy 108.060504 133.779579)))
   )
   (dimension 5.08 (width 0.3) (layer Dwgs.User)
-    (gr_text "5,0 mm" (at 113.538 96.52) (layer Dwgs.User)
+    (gr_text "5,0 mm" (at 108.966 99.187) (layer Dwgs.User)
       (effects (font (size 1.5 1.5) (thickness 0.3)))
     )
     (feature1 (pts (xy 106.934 86.106) (xy 106.934 94.14)))
@@ -1505,7 +1740,7 @@
     (arrow2b (pts (xy 107 71) (xy 108.126504 70.413579)))
   )
   (dimension 25 (width 0.3) (layer Dwgs.User)
-    (gr_text "25,000 mm" (at 204.35 93.5 270) (layer Dwgs.User)
+    (gr_text "25,000 mm" (at 204.851 98.806 270) (layer Dwgs.User)
       (effects (font (size 1.5 1.5) (thickness 0.3)))
     )
     (feature1 (pts (xy 107 106) (xy 205.7 106)))
@@ -2144,5 +2379,43 @@
         (xy 107.65 81.65) (xy 125.792513 81.65)
       )
     )
+    (filled_polygon
+      (pts
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+      )
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   )
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pcbs/transimpedance_amp/transimpedance_amp.sch

@@ -36,8 +36,8 @@ $Descr A4 11693 8268
 encoding utf-8
 Sheet 1 1
 Title "Transimpedance Amplifier"
-Date "2017-04-24"
-Rev "v0.1"
+Date "2017-05-03"
+Rev "1"
 Comp "Uppsala University"
 Comment1 ""
 Comment2 ""