(module USB3075-30-A (layer F.Cu) (tedit 5948E45D)
  (fp_text reference REF** (at 0 3.81) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value USB3075-30-A (at 0 -5.08) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (pad 2 smd rect (at 4.875 -2.65) (size 0.4 1.4) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at 4.225 -2.65) (size 0.4 1.4) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at 3.575 -2.65) (size 0.4 1.4) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at 2.925 -2.65) (size 0.4 1.4) (layers F.Cu F.Paste F.Mask))
  (pad 1 smd rect (at 2.275 -2.65) (size 0.4 1.4) (layers F.Cu F.Paste F.Mask))
  (pad "" smd rect (at 4.825 0) (size 1.75 1.9) (layers F.Cu F.Paste F.Mask))
  (pad "" thru_hole oval (at 7.15 0) (size 1.05 1.9) (drill oval 0.45 1.2) (layers *.Cu *.Mask))
  (pad "" thru_hole oval (at 0 0) (size 1.05 1.9) (drill oval 0.45 1.2) (layers *.Cu *.Mask))
  (pad "" smd rect (at 2.325 0) (size 1.75 1.9) (layers F.Cu F.Paste F.Mask))
)